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1 ? fn6015.3 caution: these devices are sensitive to electrosta tic discharge; follow proper ic handling procedures. 1-888-intersil or 321-724-7143 | intersil (and design) is a registered trademark of intersil americas inc. copyright ? intersil americas inc. 2004. all rights reserved all other trademarks mentioned are the property of their respective owners. ISL83239E 15kv esd protected, 10na supply- current, +3v to +5.5v, 250kbps, rs-232 transmitters/receivers the intersil ISL83239E contains 3.0v to 5.5v powered rs-232 transmitters/receivers which meet ela/tia-232 and v.28/v.24 specifications, even at v cc = 3.0v. additionally, it provides 15kv esd protection (iec61000-4-2 air gap and human body model) on transmitter outputs and receiver inputs (rs-232 pins). target ed applications are cell phones, pdas, palmtops, and data cables where the low operational, and even lower standby, power consumption is critical. efficient on-chip charge pu mps, coupled with the manual powerdown function, reduce the standby supply current to a 10na trickle. small footprint pa ckaging, and the use of small, low value capacitors ensure board space savings as well. data rates greater than 250kbps are guaranteed at worst case load conditions. the ISL83239E is a 5 driver, 3 receiver device that also includes a noninverting always-active receiver for ?wake-up? capability. table 1 summarizes the features of the device represented by this data sheet, while application note an9863 summarizes the features of ea ch device comprising the icl32xx 3v family. features ? esd protection for rs-232 i/o pins to 15kv (iec61000) ? drop in replacement for sp3239e ? meets eia/tia-232 and v.28/v .24 specifications at 3v ? rs-232 compatible outputs at 2.7v ? latch-up free ? on-chip voltage converters require only four external capacitors ? manual powerdown feature ? flow through pinout ? rx and tx hysteresis for improved noise immunity ? guaranteed minimum data rate . . . . . . . . . . . . . 250kbps ? guaranteed minimum slew rate . . . . . . . . . . . . . . . 6v/ s ? wide power supply range . . . . . . . single +3v to +5.5v ? low supply current in powerdow n state. . . . . . . . . .10na applications ? any system requiring rs-232 communication ports - battery powered, hand-held, and portable equipment - laptop computers, notebooks, palmtops - modems, printers and other peripherals - pda data cradles and cables - cellular/mobile phones, data cables part # information part no. temp. range (c) package pkg. dwg. # ISL83239Eia -40 to 85 28 ld ssop m28.209 ISL83239Eia-t -40 to 85 tape and reel m28.209 ISL83239Eiv -40 to 85 28 ld tssop m28.173 ISL83239Eiv-t -40 to 85 tape and reel m28.173 table 1. summary of features part number no. of tx. no. of rx. no. of monitor rx. (r outb ) data rate (kbps) rx. enable function? ready output? manual power- down? automatic powerdown function? ISL83239E 5 3 1 250 no no yes no data sheet june 2004 o b s o l e t e p r o d u ct p o s s i b l e s u b s t i t u t e p r o du c t i c l 3 2 3 8 e
2 pinout ISL83239E (ssop, tssop) top view c2+ gnd c2- v- t1 out t2 out t3 out r1 in r2 in r3 in t5 out n.c. shdn c1+ v cc c1- t1 in t2 in r1 out t4 in r3 out t5 in r1 outb n.c. v+ t3 in r2 out 28 27 26 25 24 23 22 21 20 19 18 17 16 15 1 2 3 4 5 6 7 8 9 10 11 12 13 14 t4 out pin descriptions pin function v cc system power supply input (3.0v to 5.5v). v+ internally generated positive transmitter supply (+5.5v). v- internally generated negative transmitter supply (-5.5v). gnd ground connection. c1+ external capacitor (voltage doubler) is connected to this lead. c1- external capacitor (voltage doubl er) is connected to this lead. c2+ external capacitor (voltage inverter) is connected to this lead. c2- external capacitor (voltage inverter) is connected to this lead. t in ttl/cmos compatible transmitter inputs. t out 15kv esd protected , rs-232 level (nominally 5.5v) transmitter outputs. r in 15kv esd protected , rs-232 compatible receiver inputs. r out ttl/cmos level receiver outputs. r outb ttl/cmos level, noninverting, always enabled receiver output. shdn active low input shuts down transmitters, receivers, and on-board power supply, to place device in low power mode. n.c. no internal connection. ISL83239E
3 typical operating circuit ISL83239E notes: 1. the negative terminal of c 3 can be connected to either v cc or gnd. 2. for v cc = 3.15v (3.3v -5%), use c 1 - c 4 = 0.1f or greater. for v cc = 3.0v (3.3v -10%), use c 1 - c 4 = 0.22f. 26 v cc t1 out t2 out t3 out t1 in t2 in t3 in t 1 t 2 t 3 0.1f + 0.1f + 0.1f 24 23 5 6 22 7 28 25 27 4 v+ v- c1+ c1- c2+ c2- + 0.1f 1 3 r1 out r1 in 8 5k ? r2 out r2 in 9 20 5k ? r3 out r3 in 11 18 5k ? 21 r1 outb c 1 c 2 + c 3 c 4 shdn gnd 14 +3.3v + 0.1f 16 2 v cc ttl/cmos logic levels rs-232 levels rs-232 levels r 1 r 2 r 3 + c 3 (optional connection, note 1) t4 out t5 out t4 in t5 in t 4 t 5 19 10 17 12 note 2 note 2 ISL83239E
4 absolute maximum rati ngs thermal information v cc to ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3v to 6v v+ to ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3v to 7v v- to ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3v to -7v v+ to v- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14v input voltages t in , shdn . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3v to 6v r in . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25v output voltages t out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.2v r out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3v to v cc +0.3v short circuit duration t out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . continuous esd rating . . . . . . . . . . . . . . . . . . . . . . . . . see specification table thermal resistance (typical, note 3) ja (c/w) 28 ld tssop package . . . . . . . . . . . . . . . . . . . . . . 75 28 ld ssop package . . . . . . . . . . . . . . . . . . . . . . . 100 maximum junction temperature (plastic package) . . . . . . . 150c maximum storage temperature range . . . . . . . . . . . -65c to 150c maximum lead temperature (soldering 10s) . . . . . . . . . . . . 300c (lead tips only) operating conditions temperature range ISL83239Ei . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40c to 85c caution: stresses above those listed in ?absolute maximum ratings? may cause permanent damage to the device. this is a stress o nly rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. note: 3. ja is measured with the component mounted on a low effective therma l conductivity test board in free air. see tech brief tb379 fo r details. electrical specifications test conditions: v cc = 3.15v to 5.5v, c 1 - c 4 = 0.1 f; v cc = 3v, c 1 - c 4 = 0.22 f, unless otherwise specified. typicals are at t a = 25c parameter test conditions temp (c) min typ max units dc characteristics supply current, powerdown disabled all outputs unloaded, v cc = 3.15v, shdn =v cc 25 - 0.3 1.0 ma supply current, powerdown shdn = gnd 25 - 10 300 na logic and transmitter inputs and receiver outputs input logic threshold low t in , shdn full - - 0.8 v input logic threshold high t in , shdn v cc = 3.3v full 2.0 - - v v cc = 5.0v full 2.4 - - v transmitter input hysteresis 25 - 0.5 - v input leakage current t in , shdn full - 0.01 1.0 a output leakage current shdn = gnd (receivers disabled) full - 0.05 10 a output voltage low i out = 1.6ma full - - 0.4 v output voltage high i out = -1.0ma full v cc -0.6 v cc -0.1 - v receiver inputs input voltage range full -25 - 25 v input threshold low v cc = 3.3v 25 0.6 1.2 - v v cc = 5.0v 25 0.8 1.5 - v input threshold high v cc = 3.3v to 5.0v 25 - 1.6 2.4 v input hysteresis 25 - 0.5 - v input resistance 25 3 5 7 k ? transmitter outputs output voltage swing all transmitter outputs loaded with 3k ? to ground full 5.0 5.4 - v output resistance v cc = v+ = v- = 0v, transmitter output = 2v full 300 10m - ? output short-circuit current full - 35 60 ma output leakage current v out = 12v, v cc = 0v or 3v to 5.5v, shdn =gnd full - - 25 a ISL83239E
5 detailed description the ISL83239E operates from a single +3v to +5.5v supply, guarantees a 250kbps minimum data rate, requires only four small external 0.1 f (0.22 f for v cc = 3.0v) capacitors, features low power consumptio n, and meets all eia/tia-232 and v.28 specifications. the circuit is divided into three sections: the charge pump, the transmitters, and the receivers. charge-pump intersil?s new 3v rs-232 family utilizes regulated on-chip dual charge pumps as voltage doublers, and voltage inverters to generate 5.5v transmitter supplies from a v cc supply as low as 3.0v. this allows these devices to maintain rs-232 compliant output levels over the 10% tolerance range of 3.3v powered systems. the efficient on-chip power supplies require only four small, external 0.1 f capacitors for the voltage doubler and inverter functions at v cc =3.3v. see the ?capacitor selection? section, and table 3 for capacitor recommendations for other operating conditions. the charge pumps operate discontinuously (i.e., they turn off as soon as the v+ and v- supplies are pumped up to the nominal values), resulting in significant power savings. transmitters the transmitters are proprietary, low dropout, inverting drivers that translate ttl/cm os inputs to eia/tia-232 output levels. coupled with the on-chip 5.5v supplies, these transmitters deliver tr ue rs-232 levels over a wide range of single supply system voltages. all transmitter outputs disable and assume a high impedance state when the device enters the powerdown mode (see table 2). these outputs may be driven to 12v when disabled. the ISL83239E guarantees a 250kbps data rate for full load conditions (3k ? and 250pf), v cc 3.0v, with one transmitter operating at full speed. under more typical conditions of v cc 3.3v, c 1-4 = 0.1 f, r l =3k ? , and c l = 250pf, one transmitter easily operates at 1mbps. transmitter inputs float if left unconnected, and may cause i cc increases. connect unused inputs to gnd for the best performance. receivers the ISL83239E contains standard inverting receivers that tristate when the shdn control line is driven low. additionally, it includes a noninverting (monitor) receiver (denoted by the r outb label) that is always active, regardless of the state of any co ntrol lines. all the receivers convert rs-232 signals to cm os output levels and accept inputs up to 25v while presenting the required 3k ? to 7k ? input impedance (see figure 1) even if the power is off (v cc = 0v). the receivers? schmitt trigger input stage uses hysteresis to increase noise immunity and decrease errors due to slow input signal transitions. monitor receivers remain active even during manual powerdown, making them extrem ely useful for ring indicator monitoring. standard receivers driving powered down peripherals must be disabled to prevent current flow through the peripheral?s protection diode s (see figures 2 and 3). this renders them useless for wake up functions, but the timing characteristics maximum data rate r l =3k ?, c l = 1000pf one transmitter switching full 250 700 - kbps receiver propagation delay receiver input to receiver output, c l = 150pf t phl 25 - 0.15 - s t plh 25 - 0.15 - s receiver output enable time normal operation 25 - 200 - ns receiver output disable time normal operation 25 - 200 - ns transmitter skew t phl - t plh 25 - 100 ns receiver skew t phl - t plh , c l = 150pf 25 - 50 - ns transition region slew rate v cc = 3.3v, r l =3k ? to 7k ?, measured from 3v to -3v or -3v to 3v c l = 150pf to 1000pf 25 6 17 30 v/ s c l = 150pf to 2500pf 25 4 12 30 v/ s esd performance rs-232 pins (t out , r in ) human body model 25 - 15 - kv iec61000-4-2 air gap discharge 25 - 15 - kv iec61000-4-2 contact discharge 25 - 8-kv all other pins human body model 25 - 2.5 - kv electrical specifications test conditions: v cc = 3.15v to 5.5v, c 1 - c 4 = 0.1 f; v cc = 3v, c 1 - c 4 = 0.22 f, unless otherwise specified. typicals are at t a = 25c (continued) parameter test conditions temp (c) min typ max units ISL83239E
6 corresponding monitor receiver can be dedicated to this task as shown in figure 3. powerdown functionality this 3v device requires a nominal supply current of 0.3ma during normal operation (not in powerdown mode). this is considerably less than the 5ma to 11ma current required of 5v rs-232 devices. the already low current requirement drops significantly when the device enters powerdown mode. in powerdown, supply current drops to 10na, because the on-chip charge pump turns off (v+ collapses to v cc , v- collapses to gnd), and the transmitter outputs three-state. this micro-power mode makes the ISL83239E ideal for battery powered and portable applications. software controlled (manual) powerdown on the ISL83239E, the powerdown control is via a simple shutdown (shdn ) pin. driving this pin high enables normal operation, while driving it low forces the ic into it?s powerdown state. connect shdn to v cc if the powerdown function isn?t needed. note t hat all the transmitter and receiver outputs three-state during shutdown (see table 2). the time required to exit powerdown, and resume transmission is only 100 s. capacitor selection the charge pumps require 0.1 f capacitors for 3.3v (5% tolerance) operation. for other supply voltages refer to table 3 for capacitor values. do not use values smaller than those listed in table 3. increasing th e capacitor values (by a factor of 2) reduces ripple on the tr ansmitter outputs and slightly reduces power consumption. c 2 , c 3 , and c 4 can be increased without increasing c 1 ?s value, however, do not increase c 1 without also increasing c 2 , c 3 , and c 4 to maintain the proper ratios (c 1 to the other capacitors). when using minimum required capacitor values, make sure that capacitor values do not degrade excessively with temperature. if in doubt, use ca pacitors with a larger nominal value. the capacitor?s equivalent series resistance (esr) usually rises at low temperat ures and it influences the amount of ripple on v+ and v-. power supply decoupling in most circumstances a 0.1 f bypass capacitor is adequate. in applications that are particularly sensitive to power supply noise, decouple v cc to ground with a capacitor of the same value as the charge-pump capacitor c 1 . connect the bypass capacitor as close as possible to the ic. table 2. powerdown logic truth table shdn input transmitter outputs receiver outputs r outb output mode of operation l high-z high-z active manual powerdown h active active active normal operation r xout gnd v rout v cc 5k ? r xin -25v v rin +25v gnd v cc figure 1. inverting receiver connections figure 2. power drain through powered down peripheral old v cc powered gnd shdn = gnd v cc rx tx v cc current v out = v cc flow rs-232 chip down uart table 3. required capacitor values v cc (v) c 1 ( f) c 2 , c 3 , c 4 ( f) 3.0 to 3.6 (3.3v 10%) 0.22 0.22 3.15 to 3.6 (3.3v 5%) 0.1 0.1 4.5 to 5.5 0.047 0.33 3.0 to 5.5 0.22 1.0 figure 3. disabled receivers prevent power drain ISL83239E transition r x t x r1 outb r1 out t1 in v cc v cc to r1 in t1 out v out = hi-z powered shdn = gnd detector down uart wake-up logic ISL83239E
7 operation down to 2.7v ISL83239E transmitter outputs meet rs-562 levels ( 3.7v), at the full data rate, with v cc as low as 2.7v. rs-562 levels typically ensure interoperability with rs-232 devices. transmitter outputs when exiting powerdown figure 4 shows the response of two transmitter outputs when exiting powerdown mode. as they activate, the two transmitter outputs properly go to opposite rs-232 levels, with no glitching, ringing, nor undesirable transients. each transmitter is loaded with 3k ? in parallel with 2500pf. note that the transmitters enable only when the magnitude of the supplies exceed approximately 3v. high data rates the ISL83239E maintains the rs-232 5v minimum transmitter output voltages even at high data rates. figure 5 details a transmitter loopback test circuit, and figure 6 illustrates the loopback test result at 120kbps. for this test, all transmitters were simultaneously driving rs-232 loads in parallel with 1000pf, at 120kbps. figure 7 shows the loopback results for a single transmitter driving 1000pf and an rs-232 load at 250kbps. the static transmitters were also loaded with an rs-232 receiver. time (20s/div) t1 t2 2v/div 5v/div v cc = +3.3v shdn figure 4. transmitter outputs when exiting powerdown c1 - c4 = 0.1f figure 5. transmitter loopback test circuit figure 6. loopback test at 120kbps figure 7. loopback test at 250kbps ISL83239E v cc c 1 c 2 c 4 c 3 + + + + c l v+ v- 5k t in r out c1+ c1- c2+ c2- r in t out + v cc 0.1f v cc shdn t1 in t1 out r1 out 5s/div v cc = +3.3v 5v/div c1 - c4 = 0.1f t1 in t1 out r1 out 2s/div 5v/div v cc = +3.3v c1 - c4 = 0.1f ISL83239E
8 interconnection with 3v and 5v logic the ISL83239E directly interfaces with 5v cmos and ttl logic families. nevertheless, wit h the device at 3.3v, and the logic supply at 5v, ac, hc, and cd4000, outputs can drive ISL83239E inputs, but ISL83239E outputs do not reach the minimum v ih for these logic families. see table 4 for more information. 15kv esd protection all pins on isl832xx devices include esd protection structures, but the isl83239 e incorporates advanced structures which allow the rs-232 pins (transmitter outputs and receiver inputs) to survive esd events up to 15kv. the rs-232 pins are particularly vulnerable to esd damage because they typically connect to an exposed port on the exterior of the finished pro duct. simply touching the port pins, or connecting a cable, can cause an esd event that might destroy unprotected ics. these new esd structures protect the device whether or not it is powered up, protect without allowing any latchup mechanism to activate, and don?t interfere with rs-232 signals as large as 25v. human body mode l (hbm) testing as the name implies, this test method emulates the esd event delivered to an ic during human handling. the tester delivers the charge through a 1.5k ? current limiting resistor, making the test less severe th an the iec61000 test which utilizes a 330 ? limiting resistor. the hbm method determines an ics ability to withstand the esd transients typically present during handling and manufacturing. due to the random nature of these ev ents, each pin is tested with respect to all other pins. the rs-232 pins on ?e? family devices can withstand hbm esd events to 15kv. iec61000-4-2 testing the iec61000 test method applies to finished equipment, rather than to an individual ic. therefore, the pins most likely to suffer an esd event are t hose that are ex posed to the outside world (the rs-232 pins in this case), and the ic is tested in its typical application configuration (power applied) rather than testing each pin-to -pin combination. the lower current limiting resistor coupled with the larger charge storage capacitor yields a test that is much more severe than the hbm test. the extra esd protection built into this device?s rs-232 pins allows the design of equipment meeting level 4 criteria with out the need for additional board level protection on the rs-232 port. air-gap discharge test method for this test method, a charged probe tip moves toward the ic pin until the voltage arcs to it. the current waveform delivered to the ic pin depends on approach speed, humidity, temperature, etc., so it is difficult to obtain repeatable results.the ?e? device rs-232 pins withstand 15kv air-gap discharges. contact discharge test method during the contact discharge test, the probe contacts the tested pin before the probe tip is energized, thereby eliminating the variables associated with the air-gap discharge. the result is a more repeatable and predictable test, but equipment limits prevent testing devices at voltages higher than 8kv. all ?e? family devices survive 8kv contact discharges on the rs-232 pins. table 4. logic family compatibility with various supply voltages system power-supply voltage (v) v cc supply voltage (v) compatibility 3.3 3.3 compatible with all cmos families. 5 5 compatible with all ttl and cmos logic families. 5 3.3 compatible with act and hct cmos, and with ttl. ISL83239E outputs are incompatible with ac, hc, and cd4000 cmos inputs. ISL83239E
9 die characteristics substrate potential (powered up): gnd transistor count: 609 proces si gate cmos typical performance curves v cc = 3.3v, t a = 25c figure 8. transmitter output voltage vs load capacitance figure 9. slew rate vs load capacitance figure 10. supply current vs load capacitance when transmitting data figure 11. supply current vs supply voltage -6 -4 -2 0 2 4 6 1000 2000 3000 4000 5000 0 load capacitance (pf) transmitter output voltage (v) 1 transmitter at 250kbps v out + v out - other transmitters at 30kbps load capacitance (pf) slew rate (v/s) 0 10002000300040005000 5 10 15 20 25 +slew -slew -slew 20 25 30 35 40 55 45 50 0 1000 2000 3000 4000 5000 load capacitance (pf) supply current (ma) 20kbps 250kbps 120kbps supply current (ma) 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 0 0.5 1.0 1.5 2.0 supply voltage (v) 2.5 3.0 3.5 no load all outputs static ISL83239E
10 shrink small outline plastic packages (ssop) notes: 4. symbols are defined in the ?mo seri es symbol list? in section 2.2 of publication number 95. 5. dimensioning and tolerancing per ansi y14.5m - 1982. 6. dimension ?d? does not include mo ld flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078 inch) per side. 7. dimension ?e? does not include inte rlead flash or protrusions. inter- lead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side. 8. the chamfer on the body is optional. if it is not present, a visual in- dex feature must be located within the crosshatched area. 9. ?l? is the length of terminal for soldering to a substrate. 10. ?n? is the number of terminal positions. 11. terminal numbers are shown for reference only. 12. dimension ?b? does not include dambar protrusion. allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of ?b? dimension at maximum material condition. 13. controlling dimension: millimete r. converted inch dimensions are not necessarily exact. index area e d n 123 -b- 0.25(0.010) c a m bs e -a- l b m -c- a1 a seating plane 0.10(0.004) c h 0.25(0.010) b m m 0.25 0.010 gauge plane a2 m28.209 (jedec mo-150-ah issue b) 28 lead shrink small outline plastic package symbol inches millimeters notes min max min max a- 0.078 - 2.00 - a1 0.002 - 0.05 -- a2 0.065 0.072 1.65 1.85 - b 0.009 0.014 0.22 0.38 9 c 0.004 0.009 0.09 0.25 - d 0.390 0.413 9.90 10.50 3 e 0.197 0.220 5.00 5.60 4 e 0.026 bsc 0.65 bsc - h 0.292 0.322 7.40 8.20 - l 0.022 0.037 0.55 0.95 6 n28 287 0 o 8 o 0 o 8 o - rev. 1 3/95 ISL83239E
11 all intersil u.s. products are manufactured, asse mbled and tested utilizing iso9000 quality systems. intersil corporation?s quality certifications ca n be viewed at www.intersil.com/design/quality intersil products are sold by description only. intersil corpor ation reserves the right to make changes in circuit design, soft ware and/or specifications at any time without notice. accordingly, the reader is cautioned to verify that data sheets are current before placing orders. information furnishe d by intersil is believed to be accurate and reliable. however, no responsibility is assumed by intersil or its subsidiaries for its use; nor for any infringements of paten ts or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of intersil or its subsidiari es. for information regarding intersil corporation and its products, see www.intersil.com thin shrink small outlin e plastic packages (tssop) index area e1 d n 123 -b- 0.10(0.004) c a m bs e -a- b m -c- a1 a seating plane 0.10(0.004) c e 0.25(0.010) b m m l 0.25 0.010 gauge plane a2 notes: 14. these package dimensions are wi thin allowable dimensions of jedec mo-153-ae, issue e. 15. dimensioning and tolerancing per ansi y14.5m - 1982. 16. dimension ?d? does not include mold flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 17. dimension ?e1? does not include in terlead flash or protrusions. inter- lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 18. the chamfer on the body is optional. if it is not present, a visual index feature must be located within the crosshatched area. 19. ?l? is the length of terminal for soldering to a substrate. 20. ?n? is the number of terminal positions. 21. terminal numbers are shown for reference only. 22. dimension ?b? does not include dam bar protrusion. allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of ?b? dimen- sion at maximum material condition. minimum space between protru- sion and adjacent lead is 0.07mm (0.0027 inch). 23. controlling dimension: millimete r. converted inch dimensions are not necessarily exact. (angles in degrees) 0.05(0.002) m28.173 28 lead thin shrink small outline plastic package symbol inches millimeters notes min max min max a- 0.047 - 1.20 - a1 0.002 0.006 0.05 0.15 - a2 0.031 0.051 0.80 1.05 - b 0.0075 0.0118 0.19 0.30 9 c 0.0035 0.0079 0.09 0.20 - d 0.378 0.386 9.60 9.80 3 e1 0.169 0.177 4.30 4.50 4 e 0.026 bsc 0.65 bsc - e 0.246 0.256 6.25 6.50 - l 0.0177 0.0295 0.45 0.75 6 n28 287 0 o 8 o 0 o 8 o - rev. 0 6/98 ISL83239E

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